Presentation at SSI International 2020 are grouped into 6 key themes which collectively provide complete coverage of the global sensors industry.
If you are interested in speaking at SSI International 2020, please contact info@sensorsinternational.net or call +44 (0)2476 718 970.
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Autonomous vehicles need to rely on their visual perception of the road course, other road users, and traffic signs etc. at all times. Image sensors and thus automotive cameras often struggle with scenes of mixed brightness, such es entries and exits of tunnels, bridge underpasses, or low frontal sunlight. To capture all required image details in very dark and very bright areas, cameras need to show a so called High Dynamic Range (HDR). This presentation will introduce the state of the art in High Dynamic Range imaging based on practical experiments with latest automotive image sensors from leading OEMs.
IHS Markit will provide an overview of the different flavours of LiDAR , the supply chain, commercial aspects and the potential for each. Further, IHS Markit research will benchmark different LiDAR implementation approaches regarding cost, maturity timeline, and integration with other sensors. A review of the current LiDAR supply chain will also be given covering the big players as well as some promising start-ups.
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Functional inks and printed electronics solutions are offered by Henkel for many years to enable production of traditional membrane switches and more recent smart sensors. Using printed circuits, this can be done in an easy and economically attractive way. Application areas widely vary from healthcare, industry 4.0, automotive, aerospace, consumer goods and many more. In this presentation the possibilities with printed electronics and the use of functional inks will be further illustrated by a few of the many applications already on the market today.
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While hardware and especially MEMS sensors will remain a crucial part in CE and IoT devices, intelligence provided by smart algorithms within the sensors, that means at the very edge of the system, will gain more and more importance. In his presentation Wolfgang Schmitt-Hahn will introduce specific use case examples and will also give an outlook of the role of software and AI within MEMS sensors for current and new applications.
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Fiber optics are replacing traditional sensors in many applications thanks to their noise immunity as well as their size, weight and power (SWaP) advantages that outperform strain gauges and thermocouples. A single fiber optic sensor can deliver data from all along its length compared to the point-specific data collected by conventional sensors. Fiber optics can measure strain, temperature, pressure, vibration and more for applications involving the most extreme conditions such as inside engines, power plants, nuclear reactors, aircraft, or in space, conflict zones and across heavy industries. This Sensuron presentation will describe how engineers are utilizing Optical Frequency Domain Reflectometry (OFDR) fiber optic strain measurements to derive distributed shape. OFDR offers the ability to acquire strain measurements continuously along the length of an optical fiber. Coupled with fiber’s flexible routing options, this allows the capture of various data components of strain continuously or quasi-continuously along the length of substrates to which fibers are bonded. Sensuron has successfully applied its technologies in programmes working with NASA, SpaceX, Airbus, Boeing, Virgin Galactic, the Ministry of Defence and Tel Aviv University amongst many.
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For decades, MEMS and sensor engineers have relied on expensive and slow desktop simulation tools to simulate and optimize MEMS and sensor devices. Legacy desktop simulation is slow, expensive, and doesn't yield highly accurate results in 3D. Today, more leading MEMS and sensor companies are turning to the power of Cloud Engineering Simulation - advanced 3D multiphysics solvers running on cloud supercomputers - to implement true "digital prototyping" R&D processes. Digital prototypes are complete digital representations of a physical device and yield all of the bench-top test data an engineer would expect from a real prototype, but delivered at a fraction of the time and cost of a physical prototype. Learn how market-leading MEMS and sensor companies are minimizing risk, cost, and time-to-market for new designs by leveraging Cloud Engineering Simulation and Digital Prototypes.
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