David Cheskis
3D Sensing Product Line Director
Lumentum
David Cheskis, PhD, serves as the 3D Sensing Product Line Director at Lumentum where he is responsible for new sensing products. Dr. Cheskis is an expert in semiconductor, optoelectronics and communications technologies, products and markets and started the first 6-inch GaAs VCSEL wafer foundry business in 2013.
Since 1996, Dr. Cheskis has led the development of semiconductor and optical technologies and products for wireless, wireline and optical products at diverse sensing and communications companies including LeddarTech, IQE plc, II-VI Incorporated, ANADIGICS Inc, Oclaro Inc., Sarnoff Corporation, Jazz Semiconductor, Multilink Technology Corporation, and Vitesse Semiconductor.
Dr. Cheskis earned PhD and MS degrees in Electrical Engineering from the University of California, San Diego and a BSEE degree in Microelectronic Engineering from Rochester Institute of Technology. He is a Senior Member of the IEEE.
Presentations
Addressable High-Performance Multi-Junction VCSEL Arrays for Advanced Sensing Applications
Vertical Cavity Surface Emitting Lasers (VCSELs) have evolved from low power data communications applications to high volume 3D sensing applications over the last several years. This was enabled by creating a high volume, low cost, high reliability manufacturing platform that included chip design, wafer fabrication, and laser test. Having already shipped over 1 Billion high power VCSEL chips, Lumentum is pioneering new manufacturing advances that will address advanced applications including Automotive LiDAR, AIoT, AR/VR/MR, wearables, and biometric identification. This presentation will describe new VCSEL design and manufacturing approaches that allow addressable arrays using multi-junction materials to reach higher power, greater efficiency, and improve design flexibility. We will also discuss how these VCSEL advances are well matched to state-of-the-art sensors that improve LiDAR and other sensing systems.