Bruno GHYSELEN holds a PhD in Materials science obtained from University Paris 7. During his thesis, he focused on Josephson junctions. This work was realised within THOMSON-CSF/ Laboratoire Central de Recherches (now within THALES). He pursued this collaborative work by joining as a research associate the University of Cambridge (UK/ Mat. Sci. Dept). He joined SOITEC mid 1995, just before SOITEC revealed its new Smart Cut technology dedicated to the manufacturing of a new generation of SOI substrates. Within SOITEC, he has been in charge of different R&D programs and collaborations (wafer suppliers, SOITEC customers, equipment suppliers, Universities, R&D public organizations ..). Most of these programs were dedicated to the development of advanced SOI and other advanced composite substrates for specific applications, like for instance MEMS applications in general (including cavity SOI and thin film piezo) and also on the heterogeneous integration of III-V materials on silicon platforms.