PRESENTATION

Wafer-level process solutions for advanced sensor integration

Today’s sensor devices exhibit a high level of integration to meet the required performance and reliability. Many emerging applications need to combine different disciplines such as photonics, biomedical and nanotechnology at the device-level, pushing the demands even further. To cope with the higher system complexity and still reduce footprint, power consumption and cost, wafer-level processing is the most efficient integration method. Wafer bonding, for example, is one of the key technologies driving advances in system integration. This presentation will discuss the requirements and capabilities of such semiconductor processing solutions for next generation sensor devices.