In recent years we’re seeing more and more sensors being used in every field of the industry, rapid development of technology, rapid scaling down both in size and in price. Many of those sensors however encounter setbacks while scaling up the manufacturing towards volume production, struggling with integration, performance, and costs. It is even more visible in medical and healthcare applications, where additional attention is put on patient safety, accuracy of the results, and miniaturization. In this presentation we will explore some of those roadblocks and how they can be solved, utilizing our in-house solutions – such as wafer-level flex-to-rigid, thin film processing, as well as integration and packaging technologies for optoelectronic modules.
Andrzej Sielecki graduated from Warsaw University of Technology with MSc in Mechatronics, specialized in Photonics Engineering. Currently he is working as a Process Architect for Photonic Assembly at Philips Engineering Solutions, in the department of MEMS and Micro Devices. In the current role he is focusing on solving (micro-)device assembly challenges for various photonic-related devices, including fiber coupling, lens alignment or laser applications for both medical and non-medical products. He has prior experience in product development and integration as well as in system design and installation