Dimensions are key for any product in consumer electronics and in particular for sensors this very often translates to smallest form factors. These ever shinking sensor sizes have moved many products towards wafer level manufacturing. The same is true for optical sensors and nanoimprint technology plays and essential role in this development. However, for the nanoimprint lithography it is obvious that it is not only about device dimensions. This technique e very efficient way replicate directly replicate pattern sizes down to the nanometerscale into polymer. This enables to mass manufacture a wide variety of optical components even with most complex design on wafer level.
Martin Eibelhuber is deputy head of business development at EV Group, where he focuses on the application of EVG’s wafer bonding, mask alignment and nanoimprint lithography technology to a variety of markets, particularly compound semiconductors, nanotechnology and photonics. He holds a PhD (Dr. techn.) in technical physics with an emphasis on nanoscience and semiconductor physics from the Johannes Kepler University Linz in Austria. As a university staff member, he gained professional experience in photonics, nanofabrication and material characterization.